Quick Dump Rinse-Basin

After the chemical treatment of wafers for cleaning, etching, or stripping applications, it is essential to properly rinse all components to avoid chemical residues. Once removed from the chemical bath, the wafer surface remains coated with chemicals, which can lead to a continuous chemical reaction outside the bath. This ongoing reaction may result in over-etching or delamination, potentially causing production failures.

To prevent these issues, wafers must be thoroughly rinsed with DI water using a quick dump rinse or a quenching process.

The Quick Dump Rinse (QDR) tank features a modular design, allowing it to be separated into two components and removed from the system. Additional convenience is provided by the integrated spray and drain system, which is designed to be removed, cleaned, or replaced together with the process tank.